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10.0-13.0/20.0-26.0 GHz GaAs MMIC Active Doubler
March 2005 - Rev 01-Mar-05
12DBL0409 Chip Device Layout
Features
Excellent Mixer Driver 2-Stage Active Design Can be Used to Drive XR1002 Receiver +15 dBm Output Drive 100% On-Wafer RF, DC and Output Power Testing 100% Visual Inspection to MIL-STD-883 Method 2010
General Description
Mimix Broadband's two stage 10.0-13.0/20.0-26.0 GHz GaAs MMIC doubler has a +15.0 dBm output drive and is an excellent LO doubler that can be used to drive fundamental mixer devices. It is also well suited to drive Mimix's XR1002 receiver device. This MMIC uses Mimix Broadband's 0.15 m GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-toPoint Radio, LMDS, SATCOM and VSAT applications.
Electrical Characteristics (Ambient Temperature T = 25 oC)
Parameter Units Input Frequency Range (fin) GHz Output Frequency Range (fout) GHz Input Return Loss (S11) dB Output Return Loss (S22) dB Fundamental Level at the Output dBc RF Input Power (RF Pin) dBm Output Power at +9.0 dBm Pin (Pout) dBm Drain Bias Voltage (Vd1,2) VDC Gate Bias Voltage (Vg1) VDC Gate Bias Voltage (Vg2) VDC Supply Current (Id1,2) (Vd=3.5V, Vg1=-0.7V, Vg2=-0.2 Typical) mA Min. 10.0 20.0 -1.2 -1.2 Typ. TBD TBD -30.0 +9.0 +15.0 +3.5 -0.7 -0.2 70 Max. 13.0 26.0 +5.5 +0.1 +0.1 100
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Supply Voltage (Vd) Supply Current (Id) Gate Bias Voltage (Vg) Input Power (RF Pin) Storage Temperature (Tstg) Operating Temperature (Ta) Channel Temperature (Tch)
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Absolute Maximum Ratings
(1) Channel temperature affects a device's MTBF. It is recommended to keep channel temperature as low as possible for maximum life.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. (c)2005 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
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+6.0 VDC 110 mA +0.3 VDC +15.0 dBm -65 to +165 OC -55 to MTTF Table1 MTTF Table 1
Page 1 of 6
10.0-13.0/20.0-26.0 GHz GaAs MMIC Active Doubler
March 2005 - Rev 01-Mar-05
12DBL0409
Doubler Measurements
0409_typical: Pout (2xFin) vs. Fin (GHz) Pin = 6 & 9dBm, Regulated Bias: VD1=3.5V, ID1=20mA, VD2=3.5, ID2=50mA
20
15
Pout (2xFin)
10
5
Pout (2xFin)
0
-5
-10
-15
-20
-25
-30 6 7 8 9 10
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11 12
20 15 10 5 Pout (2xFin) 0 -5 -10 -15 -20 -25 -30 8
13
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14 15 16
0409_wafer_sweep: Pout (2xFin) vs. Fin (GHz) Pin = 9dBm, Regulated Bias: VD1=3.5V, ID1=20mA, VD2=3.5, ID2=50mA Pout (2xFin) Pout (1xFin)
9 10 11 Fin (GHz) 12 13 14 15
Pout (1xFin)
Fin (GHz)
20
18
16
Pout (2xFin)
Pout (2xFin)
12
10
8
6
4
2
0 8 9
Pr
10
11
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14
12
13
Fin (GHz)
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14 15
0409_wafer_sweep: Pout (2xFin) vs. Fin (GHz) Pin = 9dBm, Regulated Bias: VD1=3.5V, ID1=20mA, VD2=3.5, ID2=50mA
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. (c)2005 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
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, Pin (dBm)=6 , Pin (dBm)=9 , Pin (dBm)=6 , Pin (dBm)=9
Page 2 of 6
10.0-13.0/20.0-26.0 GHz GaAs MMIC Active Doubler
March 2005 - Rev 01-Mar-05
12DBL0409
0.483 (0.019) 0.881 (0.035)
Mechanical Drawing
0.970 (0.038)
2
3
0.605 (0.024)
1
4
6
0.0
5
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0.0 0.394 (0.016)
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1.620 (0.064)
Bond Pad #5 (Vg2) Bond Pad #6 (Vg1)
Bypass Capacitors - See App Note [2]
Vd1 Vd2 RF In RF Out Vg1 Vg2
0.795 (0.031)
(Note: Engineering designator is 12DBL0409)
Bond Pad #1 (RF In) Bond Pad #2 (Vd1)
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Bias Arrangement
Vd1
RF In
1
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2
3
6
5
Vg1
Vg2
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Vd2
4
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad. Thickness: 0.115 +/- 0.010 (0.0045 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold All Bond Pads are 0.100 x 0.100 (0.004 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 0.974 mg. Bond Pad #3 (Vd2) Bond Pad #4 (RF Out)
RF Out
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. (c)2005 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
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0.362 (0.014)
Page 3 of 6
10.0-13.0/20.0-26.0 GHz GaAs MMIC Active Doubler
March 2005 - Rev 01-Mar-05
12DBL0409
App Note [1] Biasing - It is recommended to separately bias each doubler stage Vd1 through Vd2 at Vd(1,2)=3.5V with Id1=20mA
App Note [2] Bias Arrangement -
For individual Stage Bias (Recommended for doubler applications) -- Each DC pad (Vd1, 2 and Vg1, 2) needs to have DC bypass capacitance (~100-200 pf ) as close to the device as possible. Additional DC bypass capacitance (~0.01 uF) is also recommended.
MTTF Tables
These numbers were calculated based on accelerated life test information and thermal model analysis received from the fabricating foundry.
Backplate Temperature 55 deg Celsius 75 deg Celsius 95 deg Celsius
Channel Temperature 96.6 deg Celsius 119.6 deg Celsius 142.3 deg Celsius
Rth
MTTF Hours
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FITs
169.6 C/W 181.9 C/W 193.0 C/W
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2.75E+10 1.95E+09 1.91E+08
3.64E-02 5.13E-01 5.24E+00
Pr
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Bias Conditions: Vd1=Vd2=3.5V, Id1=20 mA, Id2=50 mA
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. (c)2005 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
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and Id2=50mA. Separate biasing is recommended if the doubler is to be used at high levels of saturation, where gate rectification will alter the effective gate control voltage. It is also recommended to use active biasing to keep the currents constant as the RF power and temperature vary; this gives the most reproducible results. Depending on the supply voltage available and the power dissipation constraints, the bias circuit may be a single transistor or a low power operational amplifier, with a low value resistor in series with the drain supply used to sense the current. The gate of the pHEMT is controlled to maintain correct drain current and thus drain voltage. The typical gate voltages needed to do this are Vg1=-0.7V and Vg2=-0.2V. Typically the gate is protected with Silicon diodes to limit the applied voltage. Also, make sure to sequence the applied voltage to ensure negative gate bias is available before applying the positive drain supply.
Page 4 of 6
10.0-13.0/20.0-26.0 GHz GaAs MMIC Active Doubler
March 2005 - Rev 01-Mar-05
12DBL0409
Device Schematic
Typical Application
XR1002
pr
X2
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BPF
uc Pr eRF IN 21.5-23.5 GHz IR Mixer IF Out 2 GHz AGC Control Atten=0-12dB 12DBL0409 19.5-21.5 GHz (USB Operation) 23.5-25.5 GHz (LSB Operation) LO(+9.0dBm) 9.75-11.75 GHz 11.75-12.75 GHz
Mimix Broadband MMIC-based 20.0-26.0 GHz Doubler/Receiver Block Diagram
(Changing LO and IF frequencies as required allows design to operate as high as 26 GHz)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. (c)2005 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
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Page 5 of 6
10.0-13.0/20.0-26.0 GHz GaAs MMIC Active Doubler
March 2005 - Rev 01-Mar-05
12DBL0409
Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: Do not ingest. Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed. Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum wire should be avoided. Thermo-compression bonding is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible. Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 6 of 6
Characteristic Data and Specifications are subject to change without notice. (c)2005 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
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Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Ablestick 84-1LMI or 84-1LMIT cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.001 2 thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximately 280 C (Note: Gold Germanium should be avoided). The work station temperature should be 310 C + 10 C. Exposure to these extreme temperatures should be kept to minimum. The collet should be heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during placement.
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ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
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Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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